16 internal banks. Bi-Directional Differential Data Strobe. 8 bit pre-fetch. Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop). Supports ECC error correction and detection. On-Die Termination (ODT). Temperature sensor with integrated SPD. This product is in compliance with the RoHS directive. Per DRAM Addressability is supported. Internal Vref DQ level generation is available. Write CRC is supported at all speed grades. CA parity (Command/Address Parity) mode is supported. Features. JEDEC standard. Yes. Lead plating. Gold. SPD profile. Yes. Programming power voltage (VPP). 2.5 V. Row active time. 32 ns. Refresh row cycle time. 350 ns. Row cycle time. 45.75 ns. Module configuration. 8192M x 72. Memory voltage. 1.2 V. Memory ranking. 2. Memory data transfer rate. 3200 MT/s. CAS latency. 22. ECC. Yes. Memory form factor. 288-pin DIMM. Component for. PC/Server. Internal memory type. DDR4. Memory layout (modules x size). 1 x 64 GB. Internal memory. 64 GB. Buffered memory type. Registered (buffered). Operational conditions. Storage temperature (T-T). -55 - 100 °C. Operating temperature (T-T). 0 - 85 °C. Technical details. Compliance certificates. RoHS. Weight & dimensions. Height. 18.8 mm. Width. 133.3 mm. Logistics data. Harmonized System (HS) code. 84733020. leaflet
