Intel® Xeon® Gold 5317 3 GHz. 18 MB LGA 4189. Processor cores: 12 10 nm 64-bit 150 W. Maximum internal memory supported by processor: 6.14 TB DDR4-SDRAM. Tray. Processor. Thermal Design Power (TDP). 150 W. Processor cache. 18 MB. Processor boost frequency. 3.6 GHz. Processor operating modes. 64-bit. Processor threads. 24. Component for. Server/workstation. Cooler included. No. Processor lithography. 10 nm. Processor socket. LGA 4189. Processor cores. 12. Processor base frequency. 3 GHz. Processor model. 5317. Processor generation. 3rd Generation Intel® Xeon® Scalable. Processor family. Intel® Xeon® Gold. Processor manufacturer. Intel. Memory. ECC. Yes. Memory channels. Octa-channel. Memory clock speeds supported by processor. 2933 MHz. Memory types supported by processor. DDR4-SDRAM. Maximum internal memory supported by processor. 6.14 TB. Graphics. Discrete graphics card model. Not available. On-board graphics card model. Not available. On-board graphics card. No. Discrete graphics card. No. Features. Scalability. 2S. PCI Express slots version. 4.0. Maximum number of PCI Express lanes. 64. Market segment. Server. Packaging data. Package type. Tray
The HPE Intel Xeon-Gold 5317 processor, with its high clock speed and significant cache size, excels in demanding data processing tasks requiring multiple high-performance computing threads, making it a suitable choice for businesses processing large volumes of structured and unstructured data in high-performance computing environments or for scientific research applications that benefit from multi-core processing capabilities.
